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产品展示/PRODUCTS
The PELCO® FlipScribe® (formerly from LatticeGear™) takes scribing to a new performance level, making clean, straight scribe lines on the back side to allow the user to accurately cleave front side targets, bonded wafers, glass, sapphire and other substrates. It integrates a robust diamond scribe into a sample platform with a fence guide design. The time required to align and scribe is about 1 minute. It allows users to accurately position the scribe mark relative to features on the front side, visualized either by eye or with a user-supplied high magnification microscope. The PELCO®FlipScribe® also offers a quick method for cleanly downsizing large area samples, by the use of a "scribe s" which allows the operator to define the length of the scribe. The PELCO® FlipScribe® is a compact, stable, accurate, fast and low cost scribing and cleaving solution suitable for any lab; no utilities are required for its operation. Features
OperationThe sample is placed face up on the bed of the PELCO® FlipScribe®, with the left rail being used to set the position of the scribe and being locked in place. The depth and angle of the scriber tip is adjustable, with the optimal depth and angle depending on the sample type. The s is set to prevent the blue bar from impacting the sample, and the sample is drawn over the scriber tip to make the scribe. A variety of sample holders are available with many form factors including standard wafer sizes, down to individual small dies. After scribing, the cleave is made using cleaving pliers. |
更新时间:2024/4/1 22:41:22
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