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PELCO®LatticeAx®225晶圆精密划片裂片切割机
The PELCO® LatticeAx® 225 Precision Indent and Cleaving System (formerly from LatticeGear™) builds on the patented PELCO® LatticeAx® 120 base system with the addition of high magnification imaging, enabling increased precision of indenter positioning. This results in samples cleaved with increased accuracy. The PELCO® LatticeAx® 225 can deliver 20μm positional accuracy with high quality cleaved surfaces in approximately 5 minutes for a trained operator. The imaging package includes a focusing mount, a digital microscope with polarizer and real-time image acquisition and display software. Through realtime imaging, the indent is placed accurately with respect to the target making cleaving the sample target simple and fast for all trained users. The PELCO® LatticeAx® 225 accepts samples of multiple material types through a wide range of surface area sizes and thicknesses. | ||||||||||||||
Features
| SMB6 Cleaved with the LatticeAx® | Cleaved Sapphire Wafer | Cleaved Copper Film on Silicon | |||||||||||
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更新时间:2024/4/1 22:32:04
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